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Xiaomi Mix Fold Next Gen to Feature Passport-Style Design and XRing O3 Chip

Daniel Cross 0 comments 2 min read

Xiaomi Mix Fold Next Gen leaks suggest a passport- style foldable design, XRing O3 in- house SoC, and 6000 mAh battery capacity.

Xiaomi Xiaomi Mix Fold (Next Generation)
ANDROID

Xiaomi is shifting its foldable strategy away from the traditional book-style design that has dominated the market for years. This pivot to a passport-style form factor could reshape how users carry and use large-screen Android devices. We are watching this closely because it signals a potential new standard for portable productivity.

New foldable design targets pocketability with custom silicon and magnetic support

The upcoming device, identified as the Xiaomi Mix Fold (Next Generation), will likely debut later this year. Leaker Smart Pikachu described the hardware as featuring a 'brand-new body design' that breaks from previous iterations. This shift targets users who find current foldables too bulky for everyday pockets.

Specifications

  • Form Factor: Passport-style foldable
  • Processor: XRing O3 (in-house SoC)
  • Battery Capacity: ~6,000 mAh
  • Design Features: Magnetic accessories support

Under the hood, the phone is expected to be powered by Xiaomi's in-house XRing O3 system-on-chip. The company is betting on this custom silicon to drive the next generation of its foldable lineup. We expect the battery capacity to sit around 6,000 mAh to support the larger display area.

The design will also include support for magnetic accessories, similar to features found on recent Xiaomi flagships. This adds a layer of modularity that current book-style rivals often lack. The combination of a new form factor and custom chips marks a distinct departure for the brand.

Source: NotebookCheck

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