PC HARDWARE Xiaomi Xring O3 Chipset Benchmarks Show 40% GPU Leap ACCESSORIES Xiaomi Mijia S100 Shaver Launches for Around $15 With USB-C and IPX7 PHONES Vivo X500 Pro Max Teased With Gimbal Stabilization GAMES GTA 6 Leak Confirms Rockstar Retains Signature Tone and Satire AMD GAMDIAS CHIONE P5-360 PRO and M5-360 AIO Coolers Launch with LCD Displays PC HARDWARE Snapdragon 8 Elite Extreme Gen 6 Scores Lower Than Gen 5 in Early Benchmarks AMD Colorful iGame X870E VULCAN W OC Motherboard Launches for $594 STEAM Ylem’s Cat action adventure game announced for PC via Steam NINTENDO SWITCH 2 D3 Publisher Brings Earth Defense Force 5 and 6 to Switch 2 at TGS 2026 PC HARDWARE Titan Army P276MX Ultra 5K Mini LED Monitor Hits 2,000 Nits SOFTWARE AND UPDATES YouTube iPad App Fixes Bug That Hid Video Details PLAYSTATION 5 GTA 6 Leak Reaction: Ex-Rockstar Dev Calls Footage a Nothing Burger ANDROID HANDHELDS Yoniq Duo Dual-Screen Android Handheld May Debut at Gamescom 2026 GAMES Rockstar Creator Platform Expansion Signals Console UGC Push

Xiaomi Xring O3 Chipset Benchmarks Show 40% GPU Leap

Lena Fischer 0 comments 2 min read

Xiaomi's Xring O3 chipset shows strong early benchmark results, with GPU performance up to 90% higher than the previous generation.

Xiaomi Xring O3
PC HARDWARE

Xiaomi has unveiled the Xring O3, a new flagship system-on-chip designed to power its upcoming mobile devices. This release matters because it signals a major leap in processing power for the company's next generation of smartphones and foldables. Buyers looking for high-end Android hardware should watch this closely as it sets a new performance baseline for the brand.

Early prototype tests reveal significant performance gains

The Xring O3 serves as the central processor for Xiaomi's future devices, including the upcoming Mix Fold Next Gen. This chipset replaces the previous Xring O1 and aims to compete directly with Qualcomm's Snapdragon 8 Elite Gen 5 and Apple's A20 Pro. The device integrates a 10-core CPU architecture to handle demanding mobile workloads.

  • Geekbench Single-Core Score: 3,854
  • Geekbench Multi-Core Score: 15,086
  • CPU Core Count: 10
  • 3DMark Steel Nomad Light Performance: 40% higher than current-gen flagship chipsets
  • Manufacturing Process: TSMC N3P

Early benchmark results show the Xring O3 achieving a Geekbench single-core score of 3,854. The same processor reached a multi-core score of 15,086 on the 10-core CPU configuration. These tests were conducted on a prototype machine, so the results may be optimistic compared to final retail units.

The chipset is built on TSMC's N3P manufacturing process, which supports improved energy efficiency. Performance claims indicate the GPU delivers up to 90% higher graphics performance than the Xring O1. The chip also reportedly offers better efficiency than Qualcomm's Snapdragon 8 Elite Gen 5 during similar workloads.

We've been tracking Xring O3 closely — see our earlier coverage on Xiaomi Mix Fold Next Gen to. The company has not yet announced official pricing or a release date for devices using this silicon. Current data relies on prototype testing rather than verified retail performance.

Xiaomi's Xring O3 represents a significant step up in raw performance for its mobile lineup. The chipset targets the high-end smartphone market with a focus on speed and efficiency. Final performance figures will depend on how the prototype results translate to mass-produced devices.

Source: NotebookCheck

Discussion

0 comments

Leave a comment