Huawei has produced a 122.88TB solid-state drive using proprietary packaging technology to bypass US semiconductor restrictions. The company deployed the OceanDisk QLC PCIe Gen4 SSDs in its OceanStor Pacific 9926 AFA storage systems. This development marks a shift toward domestic supply chains after previous stockpiles of American components were exhausted.
Proprietary packaging enables higher rack density for enterprise servers
The new drives utilize Chinese-made NAND flash memory and employ a Die-on-Board packaging method. This technique mounts the memory dies directly onto the printed circuit board rather than using traditional TSOP or BGA approaches. The direct mounting creates shorter interconnects between components, which improves both performance and power efficiency compared to older methods.
Huawei claims this packaging approach delivers a 33 percent improvement in capacity density over conventional techniques. The company plans to release a future version with 245TB of storage. Current production focuses on meeting enterprise data center demands for higher rack density while navigating export controls.
The exact number of stacked NAND layers remains undisclosed by the manufacturer. Huawei has not released pricing information or specific availability timelines for these drives.
Source: TweakTown
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