Samsung's next flagship phones may get active cooling to handle the heat from AI workloads. The company is reportedly developing both liquid and air cooling systems for future Galaxy S models. This move addresses a growing bottleneck as on-device AI demands more processing power.
Liquid cooling system in development
A dedicated team at Samsung's Production Technology Research Institute is working on the cooling solutions. According to a report from Sisajournal-e.com, lab director Park Min said the team is prioritizing a liquid-based system. It uses a sealed, circulating loop connected directly to the chipset.
Air cooling is also being tested, but concerns about fan noise and weight make liquid cooling more attractive. The current Exynos 2600 chip uses a Heat Pass Block copper heatsink, but future AI tasks require active cooling. Active cooling would prevent thermal throttling during intensive AI workloads.
Air cooling also under evaluation
It remains unclear whether the technology will be ready for the Galaxy S27 series. The source notes that Samsung is still evaluating both approaches. If implemented, the cooling system could appear in the Galaxy S27 Ultra or later models like the Galaxy S28 Ultra.
Samsung's approach mirrors gaming phones from Nubia that use hybrid liquid and air cooling. Samsung aims to balance performance and form factor in its flagship devices. Active cooling could allow Samsung to push chip performance further without overheating.
For now, the cooling technology is still in development. Samsung has not confirmed any plans for active cooling in upcoming phones. The Galaxy S27 Ultra may or may not include such a system, depending on development progress.
Source: NotebookCheck
