SK Hynix plans to double its total semiconductor wafer production capacity by 2030. The company targets a jump from approximately 550,000 wafers per month to roughly one million. This expansion directly addresses the intense demand for high-bandwidth memory chips used in artificial intelligence systems.
South Korean chipmaker targets one million monthly wafers for data centers
The manufacturer focuses its growth on DRAM and HBM chip fabrication facilities located in South Korea and China. The Yongin Semiconductor Cluster and the M15X fab in Cheongju serve as the primary sites for this capacity increase. SK Hynix currently holds a 58 percent share of the global HBM market as of the first quarter of 2026.
The company aims to become the primary supplier for NVIDIA's upcoming Vera Rubin platform through this manufacturing push. The expansion also supports broader AI infrastructure needs that require dense memory arrays. SK Hynix recently surpassed a one trillion dollar market capitalization amid these industry trends.
Chairman Chey Tae-won stated the company intends to double overall capacity within five years despite operational hurdles. He emphasized that the firm will provide whatever resources are necessary to overcome those challenges. Bloomberg reported on these statements regarding the long-term production roadmap.
The planned output increase reflects a strategic response to sustained growth in AI data center deployments. Memory suppliers face ongoing pressure to scale fabrication lines for next-generation logic and memory products.
Source: TweakTown
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