AMD's next-generation Zen 7 CPUs, codenamed Grimlock, are reportedly targeting a late 2028 launch window after skipping intermediate manufacturing nodes to adopt TSMC's A14 process technology.
Flagship chiplet will feature up to 16 cores and next-generation cache technology
The flagship CCD architecture will feature up to 16 cores per chiplet and utilize next-generation 3D V-Cache to deliver up to 224MB of total L3 cache within a single package.
Zen 7 aims for a significant performance uplift over its predecessor, targeting a 15% to 25% IPC improvement while integrating enhanced AI acceleration capabilities directly into the CCD design.
Supply chain reports indicate AMD is securing advanced FOPLP packaging allocations through visits to Powertech Technology, reducing reliance on TSMC's internal packaging operations for future chiplet assembly.
Production timelines align with TSMC Fab 25 P1 trial runs scheduled for 2027, leading into mass manufacturing in 2028 before the Zen 7 architecture reaches consumer markets.
Industry insiders suggest these architectural changes represent a major shift from AMD's previous roadmap, which previously considered intermediate nodes like N2P and N2X before committing to the 1.4nm-class A14 process.
The Grimlock CCD specifications remain unconfirmed by AMD but reflect detailed supply chain intelligence regarding next-generation CPU manufacturing processes and performance targets for the late 2028 release window.
Source: TweakTown
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