A leaked video and SDK documentation have revealed the design and specifications of Pico Project Swan, an upcoming mixed reality headset from Pico. The device aims to deliver high-resolution visuals with a custom silicon processor designed for extended reality applications.
SDK documentation reveals dual 4K displays and custom silicon processor details for the upcoming headset.
Project Swan features dual 4K Micro-OLED displays that claim approximately 4000 pixels per inch and up to 45 pixels per degree of visual angle. The headset uses a combination of a custom Pico Silicon chip and a flagship system-on-chip with double the CPU and GPU performance of the XR2 Gen 2 processor.
The company claims the device achieves an end-to-end mixed reality latency of 12 milliseconds. It includes a separate battery pack connected via USB-C, side-mounted speakers for audio output, and dedicated motion controllers for interaction.
Pico plans to launch Project Swan globally in late 2026. The specifications were shared during GDC 2026 through SDK materials that exposed the hardware design details.
Source: NotebookCheck
