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MediaTek Dimensity 9600 Pro Specs Reveal 5.0 GHz CPU and TSMC 2nm Chip

Lena Fischer 2 min read

MediaTek Dimensity 9600 series details reveal a 5.0 GHz CPU, TSMC 2nm manufacturing, and Immortalis GPU with ray tracing support for next-gen smartphones.

MediaTek is preparing to introduce the Dimensity 9600 series of mobile processors in September 2026. The lineup includes two distinct models: the standard Dimensity 9600 and the higher-end Dimensity 9600 Pro. These chips are designed to power next-generation flagship smartphones, targeting users who demand top-tier performance for gaming and multitasking.

MediaTek Dimensity 9600 series mobile processor overview
MediaTek Dimensity 9600 series mobile processor overview

Leaked specifications show a new CPU layout and significant benchmark gains for the upcoming flagship mobile processor.

The Dimensity 9600 series shifts away from traditional core configurations by adopting a '2+3+3' CPU architecture. The architecture adopts a 2+3+3 core layout comprising two ultra-fast cores, three performance cores, and three power-efficient units. The Ultra cores on the Pro variant are expected to reach peak clock speeds of approximately 5.0 GHz.

Graphics processing relies on Arm's Immortalis 'Magni' GPU for both models. This GPU includes dedicated hardware for ray tracing and supports frame insertion technology to enhance gaming visuals. The Pro model upgrades memory support to LPDDR6 RAM and UFS 5.0 storage, while the standard version retains LPDDR5X and UFS 4.0.

Early benchmark estimates from Geekbench 6 indicate significant performance gains for the Dimensity 9600 Pro. Single-core scores are projected between 4200 and 4300, with multi-core results ranging from 12000 to 12500. These figures suggest a substantial leap in processing power over previous generations.

Geekbench 6 benchmark results for the Dimensity 9600 Pro
Geekbench 6 benchmark results for the Dimensity 9600 Pro

The release schedule coincides with industry shifts toward next-generation fabrication technologies. Reports indicate the Dimensity 9600 Pro will utilize TSMC's 2nm (N2P) process, while the standard chip may use a lower-binned 2nm or 3nm node. The manufacturing approach seeks to optimize both processing speed and energy consumption across the chip variants.

The company markets the Dimensity 9600 lineup to compete with leading options in the premium smartphone processor segment. The chips are expected to debut in upcoming flagship devices from major smartphone manufacturers. Analysts suggest the reported specs may set new standards for mobile device processing capabilities.

Source: GIZMOCHINA