Honor is reportedly testing a wide-foldable smartphone that will use the Snapdragon 8 Elite Gen 6 platform. The device represents a new form factor for the manufacturer and follows rumors of internal development work.
Rumored device features a 7.6-inch unfolded display and a 5.5-inch cover screen powered by the latest Qualcomm processor.
The rumored specifications include an approximately 7.6-inch internal display when unfolded. A cover screen measuring about 5.5 inches sits on the exterior. The processor is a 2-nanometer chip from Qualcomm.
Industry observers expect Honor to launch this device in the first half of next year. This timeline aligns with typical development cycles for new foldable hardware from major manufacturers.
The wide-foldable design targets users seeking larger screens without carrying separate tablets. Competitors have introduced various folding configurations, but Honor has not yet released a similar product in this category.
Honor has not confirmed the launch window or detailed specifications for the device.
Source: GIZMOCHINA
