Xiaomi's next flagship chipset will carry the XRING O3 name. The processor is expected to arrive around August 2025, according to sources. It will be built on TSMC's 3nm node, the same process used for Qualcomm's Snapdragon 8 Elite Gen 5.
Efficiency gains and wider adoption expected
The XRING O3 succeeds the XRING O1 and aims for wider adoption. It may power more mobile devices and even Xiaomi's upcoming electric vehicles. However, initial devices are unlikely to target the global market.
The chipset is expected to deliver significant efficiency gains over the XRING O1. Performance improvements are anticipated, especially in the mid to low frequency range. These gains come from the 3nm manufacturing process.
Qualcomm's next-generation chipset, the Snapdragon 8 Elite Gen 6 Pro, will use TSMC's 2nm N2 node. That puts the XRING O3 a generation behind in process technology. Still, the XRING O3 should offer a notable upgrade over its predecessor.
Source: XRING O3, NotebookCheck
