Qualcomm and MediaTek have announced new flagship chipsets for smartphones. The Snapdragon 8 Gen 5 was unveiled in November 2025, while the Dimensity 9400 Plus arrived in April 2025. Both are built on TSMC's 3nm process.
Both chipsets use TSMC 3nm process.
The Snapdragon 8 Gen 5 uses a custom Oryon CPU with two prime cores at 3.8 GHz and six performance cores at 3.32 GHz. The Dimensity 9400 Plus relies on an ARM CPU with one Cortex-X925 at 3.73 GHz, three Cortex-X4 at 3.3 GHz, and four Cortex-A720 at 2.4 GHz. In Geekbench 6, the Snapdragon leads with a single-core score of 2837 versus 2753 and a multi-core score of 9352 versus 8590. The Snapdragon also achieves a higher AnTuTu score of 2,961,236 compared to 2,832,547, but the Dimensity has a higher GPU score of 1,012,010 versus 974,402.
Spec comparison
| Spec | Snapdragon 8 Gen 5 | Dimensity 9400 Plus |
|---|---|---|
| Process node | 3 nm (TSMC) | 3 nm (TSMC) |
| CPU | 2×3.8 GHz Oryon + 6×3.32 GHz Oryon | 1×3.73 GHz Cortex-X925 + 3×3.3 GHz Cortex-X4 + 4×2.4 GHz Cortex-A720 |
| GPU | Adreno 829 | Arm Immortalis-G925 MP12 |
| 5G download speed | Up to 10 Gbps | Up to 7 Gbps |
| Wi-Fi 7 peak speed | 5.8 Gbps | 7.3 Gbps |
The Snapdragon 8 Gen 5 includes an X80 5G modem supporting mmWave and download speeds up to 10 Gbps. The Dimensity 9400 Plus supports sub-6GHz only with speeds up to 7 Gbps. However, the Dimensity offers faster Wi-Fi 7 peak speed at 7.3 Gbps versus 5.8 Gbps. Both chipsets support Bluetooth 6.0 and LPDDR5x memory.
Qualcomm claims the Snapdragon 8 Gen 5's NPU is 46% faster than its predecessor. MediaTek says the Dimensity 9400 Plus provides PC-grade ray tracing. The Snapdragon 8 Gen 5 was announced in November 2025, and the Dimensity 9400 Plus in April 2025. Neither company has confirmed specific device availability.
Source: GIZMOCHINA
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