Engineering samples of MediaTek's next flagship mobile processor appeared on the Chinese secondhand marketplace Xianyu, signaling that the silicon is ready for early testing. Buyers and reviewers should watch for this chip because it represents the immediate successor to the Dimensity 9500, and its availability suggests device makers are preparing for upcoming flagship smartphones. The listing included loose BGA packages marked with part numbers that align with MediaTek's recent naming conventions.
Engineering samples of the next flagship chip listed for $30
The seller, known as Jefull, has a history of distributing engineering samples of competitor chips, including Qualcomm's upcoming Snapdragon 8 Elite Extreme Gen 6. Jefull listed two specific MediaTek part numbers: MT6993Z and MT6995Z. Industry observers previously confirmed that MT6993Z corresponds to the Dimensity 9500. The MT6995Z designation is now tentatively identified as the Dimensity 9600 Pro based on this pattern.
- Package Type: FCPoP (Flip Chip Package-on-Package)
- Estimated Die Size: ~140 mm²
- Part Number: MT6995Z
Physical analysis of the listed chips indicates they use a Flip Chip Package-on-Package (FCPoP) design. This packaging method is similar to the one used in the previous generation's flagship processor. The estimated die size for the MT6995Z chip is approximately 140 square millimeters. This dimension matches the physical footprint of the Dimensity 9500, suggesting MediaTek is maintaining a consistent thermal and mechanical profile for its top-tier mobile SoCs.
The chips were listed for 200 CNY (around $29.68), which converts to approximately $29.68 USD. This price point reflects the nature of the items as untested engineering samples rather than retail products. The listing has since been removed from the marketplace. We have been tracking Dimensity 9600 Pro closely and previously covered its potential inclusion in the Oppo Find X10.
MediaTek has not officially confirmed the Dimensity 9600 Pro or the MT6995Z part number. The association remains a strong inference based on part-numbering sequences and physical package comparisons. The removal of the listing prevents further verification of the silicon's condition or performance capabilities at this time.
Source: NotebookCheck
