Leaked HyperOS user interface overlays indicate Xiaomi is actively developing a widescreen foldable smartphone. The device appears to follow the company’s existing Mix Fold series trajectory with potential model names including Mix Fold 5 or Xiaomi 18 Fold. This development signals a shift toward wider aspect ratios in the Chinese manufacturer’s folding portfolio.
Rumored device targets wider aspect ratios with Xring O3 chipset and Leica camera collaboration
The rumored handset targets the China region and relies on Xiaomi’s internal Xring O3 chipset for processing power. The design philosophy centers on maximizing screen real estate through an expanded horizontal form factor compared to previous foldables.
Camera specifications reportedly include a triple-camera system developed in collaboration with Leica. Industry reports suggest a primary sensor capable of 200 megapixels, aiming to elevate mobile photography standards within the foldable category.
Software enhancements focus on multitasking improvements tailored for the wider display through HyperOS updates. Mechanical refinements reportedly address hinge durability and folding consistency for long-term reliability.
No official pricing or availability windows have been confirmed by Xiaomi at this stage. The company has not released formal specifications or launch timelines for the rumored device.
This project aligns with broader industry trends toward larger foldable screens, though specific performance benchmarks remain unverified. Previous Mix Fold models established baseline expectations for camera quality and build materials in this segment.
All details currently stem from leaked software overlays and third-party reporting rather than official manufacturer channels. Xiaomi has not validated the chipset designation or sensor specifications.
Source: Xiaomi HyperOS leak, GIZMOCHINA
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