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AMD Ryzen 9 5900X3D leak reveals single 3D V-Cache stack with 128MB L3 and higher clocks

NicoGG 0 comments 3 min read

An AMD Ryzen 9 5900X3D engineering sample with a single 3D V- Cache stack and 128MB L3 cache has surfaced, showing higher boost clocks than previous prototypes.

AMD Ryzen 9 5900X3D processor die shot
PC HARDWARE

An engineering sample of the Ryzen 9 5900X3D has surfaced online, revealing a new hardware configuration that could impact high-end PC gaming builds. This single-stack design offers a different balance of cache and clock speed compared to previous prototypes, giving enthusiasts a clearer picture of AMD's development path. Buyers interested in 3D V-Cache technology should watch this closely as it suggests a potential shift in how AMD optimizes its latest Zen 3 chips for gaming workloads.

Single-stack 5900X3D prototype hits higher boost clocks than dual-stack version

The processor identified by the engineering sample code 100-000000652 features 12 cores and 24 threads, maintaining the core count of the standard Ryzen 9 5900X. It utilizes a single 3D V-Cache stack attached to one of its two chiplets, resulting in a total of 128MB of L3 cache. This setup divides the cache unevenly, with 96MB on the chiplet bearing the 3D stack and the standard 32MB on the other chiplet.

Specifications

  • Cores/Threads: 12 cores, 24 threads
  • L3 Cache: 128MB (96MB on one CCD, 32MB on the other)
  • TDP: 105W
  • Boost Clock: Approx. 4.65GHz (reports up to 4.85GHz)
  • Engineering Sample Code: 100-000000652
AMD Ryzen 9 5900X3D processor die shot
AMD Ryzen 9 5900X3D processor die shot

This configuration contrasts sharply with a dual-stack prototype shown to Gamers Nexus earlier, which carried 192MB of L3 cache across both chiplets. The single-stack sample reportedly achieves higher boost clocks, reading approximately 4.65GHz in CPU-Z, with some reports suggesting a maximum of 4.85GHz. This is a notable increase from the 4.4GHz boost seen on the dual-stack version, likely due to the reduced thermal and power load of a single cache stack.

The chip carries a 105W TDP, aligning with the power envelope of the standard 5900X. However, the sample requires specific legacy firmware to function, reportedly needing an older BIOS with SMU firmware version 56.70.0 to boot. It does not boot on recent BIOS versions, and the owner has reportedly asked ASRock to add support in a newer update. We previously covered the AMD Ryzen 7 5800X3D 10th Anniversary in our earlier coverage.

AMD Ryzen 9 5900X3D engineering sample on motherboard
AMD Ryzen 9 5900X3D engineering sample on motherboard

This leak confirms that AMD is testing a mid-range cache configuration for the 5900X3D, sitting between the 96MB of the 5800X3D and the 192MB of the dual-stack prototype. The higher clock speeds on this sample suggest that AMD may prioritize frequency over raw cache capacity for certain gaming scenarios. No pricing or availability information is currently available for this engineering sample.

Source: TweakTown

AMD

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