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Intel Core 360 Engineering Board Spotted at Computex 2026

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Intel's Wildcat Lake Core 360 engineering board spotted at Computex 2026 features Xe3 graphics, 18A process node, and strong multi-threaded benchmarks.

Intel Core 360 Engineering Board Spotted at Computex 2026
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has revealed an engineering board for its upcoming Wildcat Lake processor, the Core 360, at Computex 2026. The board showcases a new architecture built on Intel's 18A process node and RibbonFET transistor design. The transition to the 18A process node with RibbonFET architecture aims to improve power efficiency and performance density over prior generations.

Engineering board reveals Wildcat Lake specs and benchmark performance

The Core 360 integrates Xe3 graphics alongside the central processing unit. The board features 16GB of LPDDR5 memory to support the integrated Xe3 graphics. The board also features a Phison aiDAPTIV AI20EH solid-state drive offering 768GB of storage capacity.

Intel Core 360 engineering board with Xe3 graphics and memory modules
Intel Core 360 engineering board with Xe3 graphics and memory modules

Intel allocated an impressive 85GB cache to the 768GB SSD on this prototype. The Phison aiDAPTIV AI20EH SSD includes 85GB of cache alongside 768GB of storage to manage data efficiently. The combination of fast memory and specialized storage architecture targets workloads that require rapid access to large datasets.

Early benchmark results from PassMark indicate strong multi-threaded performance from the Wildcat Lake platform. A related entry-level model, the Core 3 305, reportedly outperformed Apple's A18 Pro chip in these tests. Online reports also suggest the Core 3 305 edges out the higher-tier Core 5 315 in certain multi-threaded scenarios.

The engineering board was spotted at Computex 2026 without an official release date or pricing information. The Core 360 is identified in sightings as a top-tier Wildcat Lake processor, although its exact core count remains unconfirmed due to being hidden under a heatsink. The exact core count remains unverified due to the chip being covered by a custom heatsink on the prototype board.

The Wildcat Lake platform utilizes Intel's 18A process node and RibbonFET architecture. RibbonFET architecture combined with the 18A process node is designed to enhance overall silicon efficiency. PassMark benchmarks indicate that the Core 3 305 variant delivers multi-threaded performance exceeding that of the Apple A18 Pro and the Core 5 315.

Source: TweakTown

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