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Snapdragon 8 Elite Gen 6 Leaked Specs: 2nm Chip, New CPU Layout

Daniel Cross 0 comments 1 min read

Leaked specs for the Snapdragon 8 Elite Gen 6 reveal a TSMC 2nm chip, a new '2+3+3' CPU layout, Adreno 845 GPU, and UFS 5.0 storage support.

Qualcomm plans to introduce the Snapdragon 8 Elite Gen 6 in September 2026. The new chipset will use a 2 nm process node manufactured by TSMC. This manufacturing shift aims to deliver significant improvements in energy efficiency and raw processing speeds.

Qualcomm plans to introduce the Snapdragon 8 Elite Gen 6 in September 2026. The new chipset will use a 2 nm process node manufactured by TSMC.

The standard model carries the model number SM8950 and features a redesigned CPU architecture. Qualcomm will replace the traditional 2+6 layout with a 2+3+3 configuration consisting of two prime cores, three performance cores, and three efficiency cores. Leaks suggest these cores could reach peak clock speeds approaching 5.0 GHz.

Graphics processing relies on an upgraded Adreno 845 GPU equipped with 12 MB of GMEM graphics cache and 6 MB of system-level cache. The chipset also includes a 6 MB last level cache for the CPU. Memory support remains at LPDDR5X standards, but storage upgrades to UFS 5.0.

Smartphones featuring this processor are expected to include Samsung Galaxy S27, Samsung Galaxy S27+, OnePlus 16, iQOO 16, and Xiaomi 18 devices. Qualcomm has not officially confirmed the launch window or specific model details.

Source: GIZMOCHINA

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