For Intel the Nova Lake family of CPU's will bring a major architectural change with the move from monolithic design to a modular multi-tile based architecture. Why does this matter? Well, it gives Intel the flexibility to mix and match core architectures along with various manufacturing process nodes. potentially giving a performance/watt boost and more flexibility for manufacturers of laptops and desktops.
Leaked die shots show Intel's new modular architecture mixing TSMC and Intel process nodes
We are getting die shots leaked that corroborate this new approach. A new approach that is supposed to help Intel compete better in the high end laptop and desktop space.
Spec comparison
| Spec | Nova Lake-HX | Nova Lake-H |
|---|---|---|
| Compute Tile Cores | Up to 8P+16E (24 hybrid) | Up to 4P+8E (12 hybrid) |
| Compute Tile Node | TSMC N2P | TSMC N2P |
| Top-end iGPU Config | 12 Xe3P cores (192 EUs) | 8 Xe3 cores (64 EUs) |
| bLLC Capacity | Up to 288MB | Up to 288MB |
The first round of leaks are focused on the Nova Lake-H and Nova Lake-HX CPU's set to be released in the first quarter of 2027. They use a complicated 6-tile design that splits up the CPU, GPU, SOC tiles across various silicon dies. the HX CPU's are aimed for the top end workload and the H series offers a slightly pared down variant for mainstream high performance laptops. This modular design allows Original Equipment Manufacturers (OEM) to better customize their offerings to certain price and thermal brackets.
Looking at the technical details we can see from the leaked images that we have a rather intricate mix of fabrication processes being used. For the Nova Lake-HX we have the Compute Tile being produced on TSMC's N2P which offers support for up to 24 hybrid cores. 8 performance cores and 16 Efficient cores. The GPU Tile sits on top of the package using Intel's 18A-P node for the HuB/SoC section.
The GPU itself is fabricated on Intel 3-E. For the top-tier HX variant you have a large integrated graphics section. 12 Xe3P cores that provide 192 Execution Units. That's 3x more than the 8 Xe3 variant of the other Nova Lake options.
To help compete in the gaming space Intel is also adding Big Last Level Cache (bLLC) cache with support for up to 288MB. This cache is supposed to help with gaming performance as other competitors have given Intel issues.
For the base Nova Lake-H the Compute Tile used is different. 55mm² in size. It can support up to 12 hybrid cores. All dimensions provided with the leaks are off by 1 to 5% to protect the source so actual dimensions may be slightly different.
For mobile the goal is late March 2027 release. For desktop the layout is an expectation only. Not confirmed.
We have done a few leaks on similar topics before like the Core Ultra 9 4950K which help give a sense on where the Nova Lake will go but this is the first time we get to see the internal tile layout. The mix of TSMC and Intel foundry processes in one package is a big deal and will drive Intel's hardware for the next couple of years.
Source: TweakTown
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